- HBM automatic alignment and contact equipment
- Apply precise iterative precision with Linear Robot and Linear Scale.
- Can cope with position repeatability within 3㎛
- Fine HBM alignment with 2D Area Camera and ultra-precise alignment of HBM Socket and MEMS Socket with Dual Optical System

- Wafer Bonding Equipment
- The alignment mark of the upper and lower glass wafer can be used to cope with position repeatability within 3 μm using the UVW Stage
- Tilting function can be used to maintain flatness in relation to the upper and lower glass wafer.
- Hardening function with UV Lamp.
- Can be built by Automating

- PCB Bump Height/Diameter inspection equipment
- Application of 3D and 2D Integrated Modules Using Photo-Triangle Method
- High-speed image acquisition and application of 3D algorithm technology
- 3D Bump Measurements
- 2D Bump measurements
- Detection parameter editing software for user convenience

- PCB Surface Inspection Equipment
- PCB surface inspection equipment with Color or MonotDI Line Scan Camera
- Powerful Inspection Area Edit Software
- Bad image and coordinate interworking software