· Wafer Unit's height inspection system
· Measurement of wafer unit/dummy/chip height and inspect crack.
· Automatically create Wafer shapes with simple recipe input
· Wafer full height measurement with Line Confocal eliminates data loss area
· Acquiring Height Data Using 3D Line Confocal Module
· Height Over / Height Under detection using a height measurement algorithm
· Crack inspection at the same time as height measurement

· Semiconductor PCB 2D/3D inspection system
· Application of 3D and 2D Integrated Modules Using Photo-Triangle Method
· High-speed image acquisition and application of 3D algorithm technology
· 3D bump measurement
· 2D Bump measurements
· Detection parameter editing software for user convenience

· Semiconductor PCB 2D/3D inspection system
· A system for real-time ultra-fast/ultra-precise inspection of the height of the bump by applying the Line Confocal scanner
· Apply scanner model to customer specifications
· Bad image and coordinate VRS interlocking software
· Powerful Inspection Area Edit Software