Equipment

close
icon

Customer Support Center

010-2215-6157 sales@inhc.co.kr
icon

Inquiry

icon

Product Info

icon

Technology

icon

Location

top_arrow

TOP

페이지 정보

profile_image
Author admin
Comments 0 comments Views 145 views Date 25-11-13 10:07

NHC-M2D3D-C1000

- PCB Bump Height/Diameter inspection equipment
- PCB Bump Height Inspection Equipment with Confocal Line Sensor
- Powerful Inspection Area Edit Software
- Bad image and coordinate interworking software

※ Download related information below.

Content

 ITEM

 Specification

 Etc

 3D Vision system

 Sensor : Line Chromatic confocal or Laser photo-triangle method / Scan Speed : 400um Less than Criteria Max 120mm/s

 Z Repeatability : 0.2um  /  X Resolution:  6.5μm/pixel (F.O.V : 11.0mm)

 Bump Height, Coplanarity 

 2D Vision system

 Camera : 18K Mono Line Scan 2Set  /  Illumination:  Power LED Red/White 2Ch  /  Resolution:  3.0 μm/pixel (F.O.V : 52mm)

 Diameter, Position, Damage 

 Inspected Products

 Height, Diameter, Position, Damage, Coplanarity 

 

 Inspection Time

 Width 80 mm, Length 300mm Less than 6 times in total Scan 30 sec

 

 System Size

 2,500mm(W) x 2,100(D) x 2,000(H) , Weight: 3.5 ton

 

 Control

 PC Base Window 10/ Motion ->Ether Cat Type / Servo Motor

 

 Main Power

 220V ±10% 50A 60Hz, 3Phase

 

 Main Air

 5-8Kg/〖cm〗^2 AIR TUBE SIZE : Ø10.0(2EA)

 

 Inspection Defect size

 Current Equipment : BUMP Height 10um More than Detectable Developable : BUMP Height 3um More than

 

댓글목록

등록된 댓글이 없습니다.