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NHC-M2D3D-C1000
- PCB Bump Height/Diameter inspection equipment
- PCB Bump Height Inspection Equipment with Confocal Line Sensor
- Powerful Inspection Area Edit Software
- Bad image and coordinate interworking software
※ Download related information below.
Content
ITEM |
Specification |
Etc |
3D Vision system |
Sensor : Line Chromatic confocal or Laser photo-triangle method / Scan Speed : 400um Less than Criteria Max 120mm/s Z Repeatability : 0.2um / X Resolution: 6.5μm/pixel (F.O.V : 11.0mm) |
Bump Height, Coplanarity |
2D Vision system |
Camera : 18K Mono Line Scan 2Set / Illumination: Power LED Red/White 2Ch / Resolution: 3.0 μm/pixel (F.O.V : 52mm) |
Diameter, Position, Damage |
Inspected Products |
Height, Diameter, Position, Damage, Coplanarity |
|
Inspection Time |
Width 80 mm, Length 300mm Less than : 6 times in total Scan 30 sec |
|
System Size |
2,500mm(W) x 2,100(D) x 2,000(H) , Weight: 3.5 ton |
|
Control |
PC Base Window 10/ Motion ->Ether Cat Type / Servo Motor |
|
Main Power |
220V ±10% 50A 60Hz, 3Phase |
|
Main Air |
5-8Kg/〖cm〗^2 AIR TUBE SIZE : Ø10.0(2EA) |
|
Inspection Defect size |
Current Equipment : BUMP Height 10um More than Detectable , Developable : BUMP Height 3um More than |
|
- prevNHC-M2D3D-L1000 25.11.13
- nextNHC-M2D-C1000 25.11.13
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