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NHC-M2D3D-L1000
- PCB Bump Height/Diameter inspection equipment
- Application of 3D and 2D Integrated Modules Using Photo-Triangle Method
- High-speed image acquisition and application of 3D algorithm technology
- 3D Bump Measurements
- 2D Bump measurements
- Detection parameter editing software for user convenience
※ Download related information below.
Content
ITEM |
Specification |
Etc |
3D Camera Type |
2M High Speed Area |
Consultation is possible |
2D Camera Type |
16M High Speed Area |
Consultation is possible |
3D X F.O.V |
10.7 / 17.7 mm |
Consultation is possible |
3D Repeat precision |
0.5 / 0.7 um |
|
3D Scan Speed |
Max 80/140 mm/s |
|
Inspect Item |
3D Bump Height, 2D faulty |
Consultation is possible |
- prevNHC-M2D-W3000 25.11.13
- nextNHC-M2D3D-C1000 25.11.13
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