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NHC-M2D-W3000
- Wafer Bonding Equipment
- The alignment mark of the upper and lower glass wafer can be used to cope with position repeatability within 3 μm using the UVW Stage
- Tilting function can be used to maintain flatness in relation to the upper and lower glass wafer.
- Hardening function with UV Lamp.
- Can be built by Automating
※ Download related information below.
Content
ITEM |
Specification |
Etc |
Equipment Size [W x L x H] |
1,095mm x 1,186mm x 1,937mm |
|
Camera Spec |
Area Mono / Pixel : 2.2um |
|
Camera purpose |
Wafer TOP/BTM Align |
|
Electrical Spec |
220V/60A |
|
Air Utility |
6 Kgf/㎠ |
|
- prevNHC-MAC-H1000 25.11.13
- nextNHC-M2D3D-L1000 25.11.13
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