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NHC-2D3D-PC-AVI
· Semiconductor Probe Card 2D/3D Inspection System
· Improve productivity/quality by reducing measurement time and data processing time
· Process defect inspection and data acquisition using inspection equipment
· Measurement equipment (3D): Tip measurement [flatness/height/coordinate], Bump measurement [size/height/flatness]
· Inspection equipment (2D): Process defect [Plating defect/size defect/Loss, etc.]
※ Download related information below.
Content
Item |
Unit |
1.5x |
10x |
20x |
FOV (1S Scan) |
µm X µm |
8,500 x 6,500 |
1,000 x 1,000 |
500 x 500 |
Lateral resolution
|
µm / Pixel |
1.95 |
1 |
0.5 |
- prevNHC-2D3D-PCB-AVI 25.12.01
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