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NHC-LLT-PCB-AVI
· Semiconductor PCB 2D/3D inspection system
· Application of 3D and 2D Integrated Modules Using Photo-Triangle Method
· High-speed image acquisition and application of 3D algorithm technology
· 3D bump measurement
· 2D Bump measurements
· Detection parameter editing software for user convenience
※ Download related information below.
Content
Item |
Specification |
Etc |
3D Camera Type |
2M High Speed Area |
Consultation is possible |
2D Camera Type |
16M High Speed Area |
Consultation is possible |
3D X F.O.V |
10.7 / 17.7 mm |
Consultation is possible |
3D Repeated Precision |
0.5 / 0.7 um |
|
3D Scan Speed |
Max 80/140 mm/s |
|
Inspect Item |
3D bump height, 2D bad |
Consultation is possible |
- prevNHC-3D-Wafer-AVI 25.12.04
- nextNHC-2D3D-PCB-AVI 25.12.01
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